Optical, thermal and dielectric properties of Copper Oxide (CuO)/ chitosan (CS)/ Polyethylene oxide (PEO) blends

Chitosan (CS)/ Polyethylene oxide (PEO) blend doped with Copper Oxide (CuO) have been produced by casting technique and the copper oxide was inserted through co-polymeric blend via laser ablation route. The nanocomposites have been investigated via XRD, FTIR, HRTEM, and FESEM, thermal, electrical, and optical examinations. The morphological features with TEM technique show injected CuO average grain size 6.7 nm for co-polymeric based nano-composites with t = 10 min, while with increasing irradiation time to reach 20 min (raising CuO content), size increases that the CuO clumps display average grain size 12.1 nm. FESEM micrographs clarify that the raising of laser irradiation time to 20 min boosts porous structure formation. Additionally, roughness average shows clear enhancement with CuO insertion that Pure Co-polymeric blend records 30.09 nm and it gets the highest value with the highest concentration of transition metal oxide (CuO) at t = 20 min (37.25 nm). Moreover, in the liquid phase pure blend represents the widest direct bandgap with 2.7 e.V, while in film form CuO/CS/PEO ternary composite with t = 10 min represents the widest direct bandgap with 3.8 e.V. The change in dielectric constant (ε′) with raising frequency then comes to be almost stable. The observed decreasing pattern is explained by the interaction of dipoles by the applied field. Henceforth, compositional, and morphological changes of polymeric composites provoke a huge development for optoelectrical applications.